Exnodes develops onboard inspection modules for continuous tool & process monitoring

Stand-alone process control

Slow feedback & feedforward loops

Onboard process control

Real-time feedback & feedforward loops

Continuous tool & process monitoring

Continuous tool & process monitoring maximizes yield in high volume manufacturing

Computational Parallel Inspection® (CPI)

  • Parallel Illumination
    • visible wavelength for adaptive & wide-field coverage
  • Computational Imaging
    • wide-field & high-resolution matched detection
  • Yield Learning
    • artificial intelligence for defect classification
  • Learn more from 10 issued patents on CPI
  • compact footprint enables onboard unpatterned inspection modules
  • applications include continuous tool/process monitoring, qualification & review

Sub-10 nm unpatterned inspection sensitivity

CPI video of three 15 nm SiO2 nanoparticles on a Silicon wafer

120 wafers/hour at 20 nm SiO2 sensitivity

Onboard inspection modules demand high sensitivity & high throughput

Tested by chipmakers

Wide dynamic range allows simultaneous detection of 8.9 nm to 100 nm defects